Development trend of silicon micro powder industry

Due to its excellent performance as a functional powder filling material, silicon micro powder products play a crucial role in the performance of downstream products. Therefore, research and development work on molten silicon micro powder products has been ongoing, aiming to improve product fineness and purity, simplify production processes, and reduce costs. These are all directions for technological innovation.

1. Ultra fine, high-purity silicon micro powder

Ultra fine silicon powder has the characteristics of small particle size, large specific surface area, high chemical purity, and good filling properties. It is widely used in many fields such as copper-clad laminates, adhesives, rubber, coatings, engineering plastics, pharmaceuticals, papermaking, and daily chemical products.

High purity silicon micro powder generally refers to silicon micro powder with SiO2 content higher than 99.9%, mainly used in industries such as IC integrated circuits and quartz glass. Its high-end products are widely used in large-scale and ultra large scale integrated circuits, optical fibers, lasers, aerospace, and military, and are essential materials for high-tech industries.

High purity silicon micro powder will become the basic material for the electronics industry in the 21st century, with rapidly increasing demand and promising market prospects. The demand for ultra pure silicon micro powder in the world is also rapidly increasing with the development of the IC industry, and it is estimated that the world's demand for it will grow at a rate of 20% in the next 10 years.

2. Spherical silicon micro powder

In recent years, the microelectronics industry has demanded not only ultrafine materials but also high purity and low radioactive element content for large-scale and ultra large scale integrated circuit packaging materials, especially for the spherical shape of particles.

According to the development plan of semiconductor integrated circuits and devices in China, the demand for spherical silicon micro powder will reach over 100000 tons in the next 4-5 years. Currently, the amount of spherical silicon micro powder used only as plastic packaging material for ultra large scale integrated circuits in China has exceeded 3000 tons.

At present, there are few enterprises capable of producing spherical silicon micro powder, and only some technologically advanced enterprises have production capacity. Conducting technological research on this material and creating high-tech products with independent intellectual property rights as soon as possible has significant economic and social significance.

3. Powder surface modification technology

Powder surface modification refers to the treatment of the surface or interface of powder materials using physical, chemical, mechanical and other methods, with the aim of changing the chemical properties of the powder material surface to meet the needs of modern new materials, new processes and new technologies.

The main methods currently used for surface modification of non-metallic mineral powders include surface chemical coating, precipitation reaction coating, intercalation modification, etc.

With the continuous development of the downstream high-end application market, the quality and stability requirements for non-metallic mineral powder materials are constantly increasing. Currently, China's non-metallic mineral powder material technology cannot meet the application needs well. Powder surface and interface modification technology will become one of the main development directions for non-metallic mineral powder processing technology.