Today, Haosen, a manufacturer of crystalline silicon micro powder, will talk to you about the impact of the amount of silicon micro powder added on epoxy casting adhesive.
With the increase of silicon micro powder content, the bending strength and tensile strength of the casting system show a trend of first decreasing, then increasing, and then decreasing again. As the amount of silicon oxide added increases, the effective filling volume also increases, reducing the solidification shrinkage of the casting sample and lowering the internal stress of shrinkage. Therefore, the tensile strength and bending strength of the casting material improve with the increase of filling amount; However, if the amount of filler added is too large, it is difficult to achieve sufficient infiltration of the resin into the filler particles, and the particles are prone to agglomerate. During the curing process, the agglomerated body will become a stress concentration point, and the mechanical strength of the cured material will actually decrease. When the amount of silicon micro powder added is small, the silicon micro powder is prone to settling in the epoxy resin, resulting in uneven dispersion and more stress concentration points, which leads to a decrease in the mechanical strength after curing.
The trend of changes in dielectric constant and dielectric loss increases with the increase of filler content, especially before 200 parts, and then tends to stabilize. This is mainly because the dielectric constant and dielectric loss of silicon micro powder are higher than those of the resin matrix. In high-grade epoxy casting adhesive, there are high requirements for the dielectric properties of the material, and the smaller the dielectric constant and dielectric loss, the better. The effect of silicon micro powder addition on the dielectric constant and dielectric loss of the system.
If you want to learn more about the price of modified silica micro powder, you can consult the crystal silicon micro powder manufacturer Haosen Mineral in detail.