What is the effect of silicon powder addition on epoxy castable adhesive?

Today, I'd like to talk with you about the influence of silicon powder addition on epoxy casting adhesive.

With the increase of silicon powder content, the bending strength and tensile strength of the casting system first decrease, then increase and then decrease. With the increase of the amount of silica, that is, the effective filling volume increases, the curing shrinkage of the cast sample is reduced, and the shrinkage internal stress is reduced. Therefore, the tensile strength and bending strength of the castable material increase with the increase of the amount of filler. However, if the amount of filler is too large, it is difficult for the resin to fully infiltrate the filler particles, and the particles are easy to agglomerate At the stress concentration point, the mechanical strength decreases. When the amount of silica powder is small, silica powder is easy to settle in the epoxy resin, resulting in uneven dispersion, resulting in more stress concentration points, resulting in the decrease of mechanical strength after curing.

The change trend of dielectric constant and dielectric loss increases with the increase of filler content, especially before 200 phr, and then tends to be stable. This is mainly because the dielectric constant and dielectric loss of silicon powder are higher than that of resin matrix. In the high-grade epoxy casting adhesive, the dielectric constant and dielectric loss of the material have higher requirements, the smaller the better. The effect of silicon powder addition on the dielectric constant and dielectric loss of the system was studied.

If you want to know more about the price of modified silicon powder, you can consult Haosen mineral, the manufacturer of crystalline silicon powder.